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Welcome to the Memory Techonology of Embedded Systems MCQs Page

Dive deep into the fascinating world of Memory Techonology of Embedded Systems with our comprehensive set of Multiple-Choice Questions (MCQs). This page is dedicated to exploring the fundamental concepts and intricacies of Memory Techonology of Embedded Systems, a crucial aspect of Embedded Systems. In this section, you will encounter a diverse range of MCQs that cover various aspects of Memory Techonology of Embedded Systems, from the basic principles to advanced topics. Each question is thoughtfully crafted to challenge your knowledge and deepen your understanding of this critical subcategory within Embedded Systems.

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Memory Techonology of Embedded Systems MCQs | Page 8 of 17

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Q71.
What is the main disadvantage in the software refresh of the DRAM?
Discuss
Answer: (d).debugging
Q72.
Which refresh technique is useful for low power consumption?
Discuss
Answer: (b).CBR
Q73.
Which refreshing techniques generates a recycled address?
Discuss
Answer: (a).RAS
Q74.
Which of the following uses a software refresh in the DRAM ?
Discuss
Answer: (d).Apple II personal computer
Discuss
Answer: (a).by asserting CAS before RAS
Q76.
Which of the refresh circuit is similar to CBR?
Discuss
Answer: (b).hidden refresh
Q77.
Which technology is standardized in DRAM for determining the maximum time interval between the refresh cycle?
Discuss
Answer: (c).JEDEC
Q78.
In which pin does the data appear in the basic DRAM interfacing?
Discuss
Answer: (a).dout pin
Q79.
What is the duration for memory refresh to remain compatible?
Discuss
Answer: (b).12 microseconds
Q80.
Which interfacing method lowers the speed of the processor?
Discuss
Answer: (a).basic DRAM interface

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