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Welcome to the Basic Computer Organization MCQs Page

Dive deep into the fascinating world of Basic Computer Organization with our comprehensive set of Multiple-Choice Questions (MCQs). This page is dedicated to exploring the fundamental concepts and intricacies of Basic Computer Organization, a crucial aspect of Computer Architecture. In this section, you will encounter a diverse range of MCQs that cover various aspects of Basic Computer Organization, from the basic principles to advanced topics. Each question is thoughtfully crafted to challenge your knowledge and deepen your understanding of this critical subcategory within Computer Architecture.

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Check out the MCQs below to embark on an enriching journey through Basic Computer Organization. Test your knowledge, expand your horizons, and solidify your grasp on this vital area of Computer Architecture.

Note: Each MCQ comes with multiple answer choices. Select the most appropriate option and test your understanding of Basic Computer Organization. You can click on an option to test your knowledge before viewing the solution for a MCQ. Happy learning!

Basic Computer Organization MCQs | Page 10 of 13

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Q91.
The cost of the die can be calculated as

a.

Cost of die= Cost of wafer Dies per wafer + Die yield

b.

Cost of die= Cost of wafer Dies per wafer - Die yield

c.

Cost of die= Cost of wafer Dies per wafer

d.

Cost of die= Cost of wafer Dies per wafer Die yield

Discuss
Answer: (c).Cost of die= Cost of wafer Dies per wafer
Q92.
Fake programs that are made to try to compare the profile and behavior of original applications, such as Dhrystone are called as

a.

Synthetic benchmarks

b.

Kernel

c.

Toy programs

d.

None of above

Discuss
Answer: (a).Synthetic benchmarks
Q93.
Data-level parallelism/task-level parallelism in a tightly coupled hardware which allows interaction among parallel threads, are processed by

a.

Instruction-Level Parallelism

b.

Request-Level Parallelism

c.

Thread-Level Parallelism

d.

Vector Architectures and Graphic Processor Units

Discuss
Answer: (c).Thread-Level Parallelism
Q94.
The no of dies/wafer is approximately the area of wafer which is divided by the area of this die. It is estimated by

a.

(? (Wafer diameter/2)2Die area)+(?

b.

(? (Wafer diameter/2)2Die area)-(?

c.

(? (Wafer diameter/2)2Die area)*(?

d.

(? (Wafer diameter/2)2Die area)(?

Discuss
Answer: (b).(? (Wafer diameter/2)2Die area)-(?
Q95.
In switching transistors the traditional primary energy-consumption, also called

a.

Static energy

b.

Dynamic energy

c.

Mechanical energy

d.

Thermal energy

Discuss
Answer: (b).Dynamic energy
Q96.
Power is energy/unit time: 1 watt =

a.

1 coulomb per second

b.

1 joule per second

c.

1 joule

d.

1second

Discuss
Answer: (b).1 joule per second
Q97.
Desktop benchmarks; which are divided into a

a.

Single broad class

b.

Two broad classes

c.

Three broad classes

d.

Four broad classes

Discuss
Answer: (b).Two broad classes
Q98.
MISD data stream is the abbreviation of

a.

Multiple instruction single data stream

b.

Multiple instruction streams, single data stream

c.

Multiple instruction streams, data stream

d.

Many instruction streams, single data stream

Discuss
Answer: (b).Multiple instruction streams, single data stream
Q99.
A time between the start and accomplishment of an event, is called a

a.

Response time

b.

Execution time

c.

Delay time

d.

both a and b

Discuss
Answer: (d).both a and b
Q100.
A 2nd key feature of server systems is

a.

Performance

b.

Scalability

c.

Price reduction

d.

Computation

Discuss
Answer: (b).Scalability
Page 10 of 13

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